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Learn about InnerSense solutions for the Semiconductor,
Solar and FPD manufacturing.​


Wafer Breakage

Problem Description:

Robots hands offs and set-ups are critical for smooth wafer handling.  If not checked on time or not done properly it can damage wafers or shed mechanical particles on the wafer. Standard methods for checking robots hand-offs are subjective and time consuming

InnerSense solution (example):

InnerSense vibration test clearly detected an impact on the wafer during pull out of loadlock due to bad robot alignment

Note: By using the fully automated system this robot mis-alignment would have been flagged, avoiding damage to production wafers

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