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Verifying that equipment parts (chucks, loadports, robot blades, wafer stages) are levelled is a complicated task in terms of physical access, suitable testing equipment and time consumption.


While SmartWafer travels inside the process tool, its sensors measure the leveling parameters of the wafer for each wafer position inside the equipment.

The SmartWafer Analysis Software produces a table which shows the relative level of each part compared with a reference level. The measurement resolution is 0.1 degree.

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