Solutions
Wafer Breakage / Wafer Scratches / Equipment Setup / Level Verification / Predictive Corrective Maintenance
Defects reduction
Problem Description:
Robots degradation and other mechanical malfunction can often generate particles that will adversely impact the die yield
InnerSense solution (example):
As part of the efforts to find the root cause of a die yield excursion caused by mechanical defects, the customer ran the SmartWafer on some of the suspected process tools. The chart below shown is clearly identifying bad robot bearings during the movement from Chamber 1 to the buffer chamber.
Note: By using the fully automated system this malfunction would have immediately be flagged
