Wafer Handling Analyzer

• General Description
• SmartWafer Specification
• Smart FOUP: Reading / Charging Station
• Docking station for FAB full automation
• SmartWafer Analysis Software
• SPC - Statistical Process Control

SmartWafer General Description

The InnerSense SmartWafer runs through the equipment and records vibrations and acceleration along its route.
After completing the recording process, the data is downloaded via an external reading station into a PC.
The data is then synchronized with the equipment sequence of events and compared to the historic "good" fingerprint.
Any abnormal signals indicate and pinpoint bad mechanical components or alignments which are causing particles, defects or scratches on the wafer

Standard 300mm and 200mm wafers are available. A common 15 gr electronics package is bonded to the wafers adding 2.5mm to the thickness across an 84mm diameter. Silicon is used to closely match the behavior of a real wafer, so it can run in the same mechanical recipe as a regular wafer in the wafer handling system. The electronic circuit is conformally coated with silicon adhesive. Sensitivity 3mG, Frequency response 10Hz to 10Khz, Operating Temperature 80 c < 15 min, 60 c with no time limit Operating Pressure. 10E-9 Torr to Atm. Battery Operation. 3hrs per charge.

Smart FOUP

 The 300mm Smart Wafer is stationed inside a Smart FOUP that contains a reading & charging unit.  Charging and communication are contactless.  A display panel on the side, shows the status the Smart Wafer and the Smart FOUP.

Docking Station for FAB full automation

The InnerSense Docking Station is designed for the 300mm automated fabs and permits the utilization of the Smart Wafer in production mode, like any other routine monitor.

 The Load Port meets all the SEMI standards, including the E84 & other SEMI standards required for OHV and HOST connectivity.

 In addition, the Docking Station automatically connects to the SmartFOUP for power charging and data communication.

 Each time a new test is initiated, the Docking Station will prepare the wafer for recording and the OHV system will send it to the designated tool.

SmartWafer Analysis Software

Acceleration: Low frequency signals are used to capture and report overall acceleration levels in the X and Y axis. Vibration: The high frequency capability enables the SmartWafer to capture detailed information caused by bearing wear, physical contact like rubbing which may shed particles or any undesirable motion of the wafer or other nearby mechanisms. Vibrations are captured in all axes. Data Analysis: Advanced pattern recognition algorithms are used to analyze traces and allow two plots to be overlaid for comparison and superimposed with time events for easy tracking. Data download: Typically less than 30secs. Software compatibility: Microsoft Windows, 2000, XP and Vista.

InnerSene welcome process equipment manufactures to integrate the software in their equipment.