Wafer Breakage

Problem description:

Process equipment can randomly break wafers. When conventional diagnostics methods are applied by the customer it is usually consuming much labor, parts and time.

InnerSense Solution(example):

As part of the efforts to find the root cause of the wafer breakage, the customer used the SmartWafer . He found that the equipment robot blade was vibrating during movement.                                                           

The chart shows the vibration intensity that is measured by the SmartWafer while it travels inside the equipment

Blue: Good signal.

Pink: Bad blade bearing caused vibrations during blade up.

The vibrations caused random wafer drops & breakage.